EA5070CAS-8.000M TR

EA5070CAS-8.000M REGULATORY COMPLIANCE (Data Sheet downloaded on Sep 22, 2020) 2011/65 + 2015/863 191 SVHC ITEM DESCRIPTION Quartz Crystal Resonator 5.0mm x 7.0mm x 1.3mm 4 Pad Ceramic Surface Mount (SMD) 8.000MHz ±50ppm at 25°C, ±100ppm over -40°C to +85°C Series Resonant ELECTRICAL SPECIFICATIONS Nominal Frequency 8.000MHz Frequency Tolerance/Stability ±50ppm at 25°C, ±100ppm over -40°C to +85°C Aging at 25°C ±3ppm/year Maximum Load Capacitance Series Resonant Shunt Capacitance 7pF Maximum Equivalent Series Resistance 90 Ohms Maximum Mode of Operation AT-Cut Fundamental Drive Level 50µWatts Maximum Spurious Response -3dB Minimum (Measured from Fo to Fo +5000ppm) Storage Temperature Range -40°C to +85°C Insulation Resistance 500 Megaohms Minimum (Measured at 100Vdc) ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500V Fine Leak Test MIL-STD-883, Method 1014, Condition A Flammability UL94-V0 Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 1 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EA5070CAS-8.000M MECHANICAL DIMENSIONS (all dimensions in millimeters) 5.00 ±0.15 2.54 ±0.20 1.2 ±0.1 (x4) MARKING ORIENTATION 4 7.00 ±0.15 1 4.6 ±0.2 3 2 1.0 ±0.2 (x4) Note: Chamfer and index mark not shown. 1.3 MAX PIN CONNECTION 1 Crystal 2 Cover/Ground 3 Crystal 4 Cover/Ground LINE MARKING 1 E8.000 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier Terminal Plating Thickness: Gold (0.3 to 1.0µm). Nickel (1.27 to 8.89µm). Suggested Solder Pad Layout All Dimensions in Millimeters 1.40 (x4) 2.20 (X4) Solder Land (X4) 3.60 1.10 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 2 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EA5070CAS-8.000M Recommended Solder Reflow Methods High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/Second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/Second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 Seconds 6°C/Second Maximum 8 Minutes Maximum Level 1 Temperature shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 3 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200 EA5070CAS-8.000M Recommended Solder Reflow Methods Low Temperature Infrared/Convection 245°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/Second Maximum N/A 150°C N/A 30 - 60 Seconds 5°C/Second Maximum 150°C 200 Seconds Maximum 245°C Maximum 245°C Maximum 2 Times / 230°C Maximum 1 Time 10 Seconds Maximum 2 Times / 80 Seconds Maximum 1 Time 5°C/Second Maximum N/A Level 1 Temperature shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 Seconds Maximum, 2 times Maximum. (Temperature shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Revision B 12/01/2015 | Page 4 of 4 Ecliptek, LLC 5458 Louie Lane, Reno, NV 89511 1-800-ECLIPTEK or 714.433.1200